US Patent Issued to Advanced Micro Devices Products (China), ATI TECHNOLOGIES on Dec. 2 for "On-chip distribution of test data for multiple dies" (Canadian, Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,282, issued on Dec. 2, was assigned to Advanced Micro Devices Products (China) Co. Ltd. (Beijing) and ATI TECHNOLOGIES ULC (Markham, Canada).

"On-chip distribution of test data for multiple dies" was invented by Arie Margulis (Markham, Canada), Tassanee Payakapan (Markham, Canada) and Yuan Chao (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-die integrated circuit uses an on-chip test distribution module to distribute test data to different dies, such as processor chiplets. The test distribution module receives test input data from an external source via one or more integrated circuit pins and distributes the test input data to the di...