US Patent Issued to Advanced Micro Devices on Sept. 9 for "Electronic device with below PCB thermal management" (California, Florida, Texas Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,226, issued on Sept. 9, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Electronic device with below PCB thermal management" was invented by Paul Theodore Artman (Orlando, Fla.), Mark Steinke (Austin, Texas) and Gamal Refai-Ahmed (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are electronic devices that utilized a thermal bus disposed on a backside of a printed circuit board (PCB) to route heat efficiently to a thermal management device disposed on the front side of the PCB, thus enhancing thermal regulation of integrated circuit (IC) devices mounted on the backside of the PCB."

The patent ...