ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,560, issued on Sept. 23, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).
"Semiconductor chip device" was invented by Chia-Hao Cheng (Taichung, Taiwan), Kong Toon Ng (Taichung, Taiwan), Rahul Agarwal (Livermore, Calif.) and Brett P. Wilkerson (Austin, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment of a semiconductor chip device can include a molding layer having a first side and a second side, an interconnect chip at least partially encased in the molding layer, the interconnect chip comprising a through substrate via (TSV) that extends through the interconnect chip, an insulating layer positioned on the first ...