US Patent Issued to Advanced Micro Devices on Oct. 28 for "Metal zero power ground stub route to reduce cell area and improve cell placement at the chip level" (Colorado Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,455,999, issued on Oct. 28, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Metal zero power ground stub route to reduce cell area and improve cell placement at the chip level" was invented by Richard T. Schultz (Ft. Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method for laying out power grid connections for standard cells are described. In various embodiments, a standard cell includes power post and ground posts in metal zero. The metal zero posts include no vias to any upper metal layers. Some variations of the standard cell have the power and ground posts routed in metal zero to a boundary edge of th...