US Patent Issued to Advanced Micro Devices on Nov. 25 for "Systems and methods for dimensioning a land grid array pad" (Chinese, American Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,738, issued on Nov. 25, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Systems and methods for dimensioning a land grid array pad" was invented by ChangWei Liang (Shanghai) and Sanjay Dandia (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for dimensioning a land grid array pad can include forming an initial landing area of a land grid array pad, wherein the initial landing area is dimensioned to cause at least a majority of a landing surface of one or more socket pins to land off of the initial landing area prior to actuation of one or more sockets including the one or more socket pins. The method ca...