ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,346, issued on May 13, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).
"High-bandwidth memory module architecture" was invented by Aaron John Nygren (Boise, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "A high-bandwidth dual-inline memory module (HB-DIMM) includes a plurality of memory chips, a plurality of data buffer chips, and a register clock driver (RCD) circuit. The data buffer chips are coupled to respective sets of the memory chips and transmit data from the memory chips over a host bus at a data rate twice that of the memory chips. The RCD circuit includes a host bus interface and a memory interface coupled to the ...