ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,130, issued on June 3, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.).
"Component cooler with spring mechanism" was invented by Robert Edward Radke (Austin, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for component cooling includes a manifold and a heat transfer element configured to be thermally coupled to a heat-generating component. The apparatus further includes a first spring mechanism between the manifold and the heat transfer element. The first spring mechanism is configured to apply a first force to the heat transfer element."
The patent was filed on Sept. 29, 2022, under Application No. 17/956,813.
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