US Patent Issued to Advanced Micro Devices on July 29 for "Electronic device including dies and an interconnect coupled to the dies and processes of forming the same" (Texas Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,645, issued on July 29, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Electronic device including dies and an interconnect coupled to the dies and processes of forming the same" was invented by Lei Fu (Austin, Texas), Raja Swaminathan (Austin, Texas) and Brett P. Wilkerson (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device can include a first die, a second die, and an interconnect. The first die or the second die has a principal function as a power module or a memory. The first die includes a first bond pad, and the second die includes a second bond pad. The device sides of the first and second d...