US Patent Issued to ADVANCED MICRO DEVICES on Jan. 13 for "Partitioning wafer processing and hybrid bonding of layers formed on different wafers for a semiconductor assembly" (California, Texas Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,573, issued on Jan. 13, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.).

"Partitioning wafer processing and hybrid bonding of layers formed on different wafers for a semiconductor assembly" was invented by Rahul Agarwal (Livermore, Calif.), Chandra Sekhar Mandalapu (Austin, Texas) and Raja Swaminathan (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor assembly that includes forming a first set of layers on a first wafer, where one or more layers of the first set includes one or more devices of the semiconductor assembly. The method further includes forming a second set of layers on a ...