US Patent Issued to ADVANCED MICRO DEVICES on Dec. 30 for "Wafer-level testing of fanout chiplets" (California, Colorado Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,371, issued on Dec. 30, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.).

"Wafer-level testing of fanout chiplets" was invented by Rahul Agarwal (Santa Clara, Calif.) and Dean Gonzales (Fort Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip for wafer-level testing of fanout chiplet, including: a die; a carrier substrate; a plurality of redistribution layers applied to the carrier substrate; and one or more first conductive pathways in the plurality of redistribution layers, wherein the one or more first conductive pathways each comprise a first end coupled to a corresponding input/output connection point of the di...