ALEXANDRIA, Va., June 5 -- United States Patent no. 12,276,850, issued on April 15, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.).

"Fanout module integrating a photonic integrated circuit" was invented by Brett P. Wilkerson (Austin, Texas), Raja Swaminathan (Austin, Texas), Kong Toon Ng (Hsinchu, Taiwan) and Rahul Agarwal (Livermore, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first mold layer at least partially encasing at least one photonic integrated circuit. A redistribution layer structure is fabricated on the first mold layer, the redistribution layer structure including dielectric material and conductive structures. A second mold layer a...