US Patent Issued to ADVANCED MICRO DEVICES, ATI TECHNOLOGIES on Sept. 16 for "Semiconductor chip having stepped conductive pillars" (California Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,994, issued on Sept. 16, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.) and ATI TECHNOLOGIES ULC (Markham, Canada).

"Semiconductor chip having stepped conductive pillars" was invented by Suming Hu (Santa Clara, Calif.) and Farshad Ghahghahi (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first width and a second portion ha...