US Patent Issued to Advanced Micro Devices, ATI Technologies on Oct. 7 for "Bounding volume hierarchy leaf node compression" (British, Canadian, American Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,465, issued on Oct. 7, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.) and ATI Technologies ULC (Markham, Canada).

"Bounding volume hierarchy leaf node compression" was invented by David William John Pankratz (Markham, Canada), David Ronald Oldcorn (Milton Keynes, Great Britain), Daniel James Skinner (Milton Keynes, Great Britain), Michael John Livesley (Milton Keynes, Great Britain) and David Kirk McAllister (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique for performing ray tracing operations is provided. The technique includes identifying triangles to include in a compressed triangle block; storing ...