ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,488, issued on June 17, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.) and ATI TECHNOLOGIES ULC (Markham, Canada).
"Stacking power delivery device dies" was invented by Arsalan Alam (Austin, Texas), Fei Guo (Markham, Canada) and Rahul Agarwal (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a power delivery device die stack including a plurality of vertically arranged power delivery device dies. The plurality of power delivery device dies including at least a first power delivery device die and a second power delivery device die electrically connected to the first power delivery d...