US Patent Issued to Advanced Micro Devices, ATI Technologies on Dec. 16 for "Systems and methods for generating a floorplan and bump placement for a package design" (Canadian, Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,300, issued on Dec. 16, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.) and ATI Technologies ULC (Markham, Canada).

"Systems and methods for generating a floorplan and bump placement for a package design" was invented by Rajagopalan Venkatramani (Hsinchu, Taiwan), Liane Martinez (Markham, Canada), Gabriel Wong (Markham, Canada) and Renato Dimatula Gaddi (Markham, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed computer-implemented method can include defining, by at least one processor, one or more boundary conditions. The method can additionally include importing, by the at least one processor, one or more tiles...