US Patent Issued to ADVANCED CHIP AND CIRCUIT MATERIALS on Oct. 7 for "Use of inorganic thin non-woven dielectrics in printed circuit boards" (California Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,513, issued on Oct. 7, was assigned to ADVANCED CHIP AND CIRCUIT MATERIALS INC. (San Jose, Calif.).

"Use of inorganic thin non-woven dielectrics in printed circuit boards" was invented by Tarun Amla (San Jose, Calif.), Keshav Amla (San Jose, Calif.) and Jyoti Amla (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Dielectric materials including non-woven inorganic fabrics impregnated with a low-density resin are disclosed. The dielectric materials may have a thickness in a range of about 5 to about 125 microns for use in printed circuit boards."

The patent was filed on April 4, 2023, under Application No. 18/130,768.

*For further info...