ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,415, issued on July 29, was assigned to Advanced Bionics AG (Staefa, Switzerland).

"Temperature sensing architectures for implantable device" was invented by R. Tissa Karunasiri (Valencia, Calif.) and Scott Kenneth Arfin (Valencia, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system may include a device configured to be implanted within a recipient and that includes an integrated circuit. The integrated circuit may include a first node configured to provide a bandgap reference voltage and a second node configured to provide a CTAT voltage. The first node may be coupled to a first input of an ADC and the second node may be coupled to a sec...