US Patent Issued to ADMATECHS on May 20 for "Filler for electronic materials and method for producing same, slurry for electronic materials, and resin composition for electronic materials" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,042, issued on May 20, was assigned to ADMATECHS Co. LTD. (Miyoshi, Japan).

"Filler for electronic materials and method for producing same, slurry for electronic materials, and resin composition for electronic materials" was invented by Kohei Ogata (Miyoshi, Japan), Yusuke Watanabe (Miyoshi, Japan) and Nobutaka Tomita (Miyoshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A filler for electronic material according to the present invention has a silica particle material produced by a dry method, wherein D50 is 0.2 micro metre or greater and 7.0 micro metre or less. Further, in the filler for electronic material according to the present invent...