US Patent Issued to ADLINK TECHNOLOGY on June 10 for "Elastic heat conduction mechanism for electronic devices" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,846, issued on June 10, was assigned to ADLINK TECHNOLOGY INC. (Taoyuan, Taiwan).

"Elastic heat conduction mechanism for electronic devices" was invented by Hsiu-Ling Yu (Taoyuan, Taiwan), Milo Li (Taoyuan, Taiwan) and Hsuan-Chan Chiang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An elastic heat conduction mechanism for electronic devices includes a heat-conducting unit and a heat-exchanging member that are tightly assembled in an elastic and floating docking adjustment to achieve the effect of preset heating element cooling. The base and heat-conducting assembly of the heat-conducting unit are floatingly assembled in the storage...