US Patent Issued to ADLINK Technology on July 29 for "Circuit board structure for mobile PCI express module" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,220, issued on July 29, was assigned to ADLINK Technology Inc. (Taoyuan, Taiwan).

"Circuit board structure for mobile PCI express module" was invented by Dong-Rui Chan (Taoyuan, Taiwan), Min-Lun Huang (Taoyuan, Taiwan) and Juang-Shin Chen (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board structure for mobile PCI express module is applied to conform to PCI Express 4.0 specification. The circuit board structure includes a top signal layer and a bottom signal layer with a core and a conductive copper wire, a power supply layer disposed between the top signal layer and the bottom signal layer, a plurality of first insulatin...