ALEXANDRIA, Va., July 16 -- United States Patent no. 12,360,361, issued on July 15, was assigned to AdHawk Microsystems Inc. (Waterloo, Canada).

"Advanced packaging for compact object-scanning modules" was invented by Niladri Sarkar (Waterloo, Canada), Dong Yan (North York, Canada), Geoffrey Lee (Kitchener, Canada), Arash Rohani (Waterloo, Canada), Nino Zahirovic (Waterloo, Canada), Duncan Wesley Strathearn (Waterloo, Canada), John Domm (Kitchener, Canada), Zhenhao Li (Waterloo, Canada) and Gregory A. Magel (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to compact packaging for optical MEMS devices, such as one- and two-dimensional light scanners. An embodiment in a...