ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,129, issued on Oct. 7, was assigned to Adela Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Heterogeneous annealing method and device" was invented by Paul M. Enquist (Cary, N.C.) and Gaius Gillman Fountain Jr. (Youngsville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of integrating a first substrate having a first surface with a first insulating material and a first contact structure with a second substrate having a second surface with a second insulating material and a second contact structure. The first insulating material is directly bonded to the second insulating material. A portion of the first substrate is remov...