ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,176, issued on Oct. 7, was assigned to ADEKA Corp. (Tokyo).
"Curable resin composition" was invented by Keisuke Ota (Kuki, Japan), Masato Inadome (Kuki, Japan), Yukako Ishigami (Kuki, Japan), Ryo Ogawa (Kuki, Japan) and Tamotsu Nagamatsu (Kuki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contain...