US Patent Issued to ADEKA on Nov. 25 for "Amide compound, polymerizable composition, cured material, and method of manufacturing cured material" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,940, issued on Nov. 25, was assigned to ADEKA Corp. (Tokyo).

"Amide compound, polymerizable composition, cured material, and method of manufacturing cured material" was invented by Kenji Hara (Tokyo), Kazuteru Nagasaka (Tokyo), Masatomi Irisawa (Tokyo) and Yuji Oda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polymerizable composition includes an amide compound represented by Formula (1) and a polymerization initiator."

The patent was filed on June 29, 2020, under Application No. 17/617,868.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&...