ALEXANDRIA, Va., July 3 -- United States Patent no. 12,344,931, issued on July 1, was assigned to ADEKA Corp. (Tokyo).
"Method of producing copper-containing layer" was invented by Akihiro Nishida (Tokyo) and Atsushi Yamashita (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of producing a copper-containing layer, including: step 1: a step of reducing a surface of a substrate, provided that a substrate having a surface formed of a silicic acid compound is excluded, through use of a reducing agent; and step 2: a step of forming a copper-containing layer on the surface having been reduced in the step 1 through use of a thin-film forming raw material containing a copper compound by a p...