US Patent Issued to Adeia Semiconductor Solutions on Dec. 9 for "Package-on-package assembly with wire bonds to encapsulation surface" (Japanese, American Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,453, issued on Dec. 9, was assigned to Adeia Semiconductor Solutions LLC (San Jose, Calif.).

"Package-on-package assembly with wire bonds to encapsulation surface" was invented by Hiroaki Sato (Yokohama, Japan), Teck-Gyu Kang (San Jose, Calif.), Belgacem Haba (Saratoga, Calif.), Philip R. Osborn (San Jose, Calif.), Wei-Shun Wang (Palo Alto, Calif.), Ellis Chau (San Jose, Calif.), Ilyas Mohammed (Santa Clara, Calif.), Norihito Masuda (Kanagawa, Japan), Kazuo Sakuma (Iwaki, Japan), Kiyoaki Hashimoto (Kanagawa, Japan), Kurosawa Inetaro (Kanagawa, Japan) and Tomoyuki Kikuchi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatuses rela...