US Patent Issued to Adeia Semiconductor Solutions on Aug. 12 for "Forming self-aligned vias and air-gaps in semiconductor fabrication" (New York Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,983, issued on Aug. 12, was assigned to Adeia Semiconductor Solutions LLC (San Jose, Calif.).

"Forming self-aligned vias and air-gaps in semiconductor fabrication" was invented by Lawrence A. Clevenger (Saratoga Springs, N.Y.), Carl J. Radens (LaGrangeville, N.Y.) and John H. Zhang (Altamont, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first trench on a mandrel line through a top mask layer and stopping at a middle mask layer; and a second trench on a non-mandrel line through the top mask layer and stopping at the middle mask layer. A spacer material is removed from a structure resulting from etching the fir...