US Patent Issued to Adeia Semiconductor Bonding Technologies on Sept. 9 for "Cold plate and manifold integration for high reliability" (California, North Carolina Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,808, issued on Sept. 9, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Cold plate and manifold integration for high reliability" was invented by Ron Zhang (Sunnyvale, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.) and Laura Wills Mirkarimi (Sunol, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device package comprising an integrated cooling assembly. The device package comprises a semiconductor device attached to a substrate and a cold plate attached to the semiconductor device. The cold plate's footprint is larger than the footprint of the semiconductor device so one or more portions of the col...