ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,460, issued on Sept. 30, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).
"Die processing" was invented by Cyprian Emeka Uzoh (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Representative implementations provide techniques and systems for processing integrated circuit (IC) dies. Dies being prepared for intimate surface bonding (to other dies, to substrates, to another surface, etc.) may be processed with a minimum of handling, to prevent contamination of the surfaces or the edges of the dies. The techniques include processing dies while the dies are on a dicing sheet or other device processing film...