US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Sept. 23 for "Direct bonding methods and structures" (California Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,584, issued on Sept. 23, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Direct bonding methods and structures" was invented by Cyprian Emeka Uzoh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding method can include polishing a first bonding layer of a first element for direct bonding, the first bonding layer comprises a first conductive pad and a first non-conductive bonding region. After the polishing, a last chemical treatment can be performed on the polished first bonding layer. After performing the last chemical treatment, the first bonding layer of the first element can be directly b...