US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Sept. 16 for "Mitigating surface damage of probe pads in preparation for direct bonding of a substrate" (California, North Carolina Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,950, issued on Sept. 16, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Mitigating surface damage of probe pads in preparation for direct bonding of a substrate" was invented by Guilian Gao (San Jose, Calif.), Laura Wills Mirkarimi (Sunol, Calif.) and Gaius Gillman Fountain Jr. (Youngsville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Mitigating surface damage of probe pads in preparation for direct bonding of a substrate is provided. Methods and layer structures prepare a semiconductor substrate for direct bonding processes by restoring a flat direct-bonding surface after disruption of probe pad surfaces...