US Patent Issued to Adeia Semiconductor Bonding Technologies on Oct. 7 for "DBI to Si bonding for simplified handle wafer" (North Carolina, California Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,122, issued on Oct. 7, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"DBI to Si bonding for simplified handle wafer" was invented by Chandrasekhar Mandalapu (Morrisville, N.C.), Gaius Gillman Fountain Jr. (Youngsville, N.C.) and Guilian Gao (Campbell, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices and techniques include process steps for preparing various microelectronic components for bonding, such as for direct bonding without adhesive. The processes include providing a first bonding surface on a first surface of the microelectronic components, bonding a handle to the prepared first bonding surface...