US Patent Issued to ADEIA Semiconductor Bonding Technologies on Oct. 28 for "Structures with through-substrate vias and methods for forming the same" (North Carolina, California Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,662, issued on Oct. 28, was assigned to ADEIA Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Structures with through-substrate vias and methods for forming the same" was invented by Gaius Gillman Fountain Jr. (Youngsville, N.C.), Cyprian Emeka Uzoh (San Jose, Calif.), George Carlton Hudson (San Jose, Calif.) and John Posthill (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic structure with through substrate vias (TSVs) and method for forming the same is disclosed. The microelectronic structure can include a bulk semiconductor with a via structure. The via structure can have a first and second conductive...