ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,445, issued on Oct. 21, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).
"Protective elements for bonded structures" was invented by Javier A. DeLaCruz (San Jose, Calif.), Belgacem Haba (Saratoga, Calif.) and Rajesh Katkar (Milpitas, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed ove...