US Patent Issued to Adeia Semiconductor Bonding Technologies on Oct. 21 for "Bonded structure including an obstructive element directly bonded to a semiconductor element without an adhesive" (California Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,439, issued on Oct. 21, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Bonded structure including an obstructive element directly bonded to a semiconductor element without an adhesive" was invented by Belgacem Haba (Saratoga, Calif.), Javier A. DeLaCruz (San Jose, Calif.), Rajesh Katkar (Milpitas, Calif.) and Arkalgud R. Sitaram (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry and a first bonding layer. The bonded structure can include a protective element directly bonded to the se...