US Patent Issued to Adeia Semiconductor Bonding Technologies on Nov. 25 for "Metal pads over TSV" (California, North Carolina Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,776, issued on Nov. 25, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Metal pads over TSV" was invented by Guilian Gao (San Jose, Calif.), Bongsub Lee (Santa Clara, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.), Cyprian Emeka Uzoh (San Jose, Calif.), Laura Wills Mirkarimi (Sunol, Calif.), Belgacem Haba (Saratoga, Calif.) and Rajesh Katkar (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Representative techniques and devices including process steps may be employed to mitigate the potential for delamination of bonded microelectronic substrates due to metal expansion at a bonding interface....