US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on May 20 for "Circuitry for electrical redundancy in bonded structures" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,332, issued on May 20, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Circuitry for electrical redundancy in bonded structures" was invented by Javier A. DeLaCruz (San Jose, Calif.), Belgacem Haba (Saratoga, Calif.) and Jung Ko (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure is disclosed. The bonded structure can include a first element that has a first plurality of contact pads. The first plurality of contact pads includes a first contact pad and a second redundant contact pad. The bonded structure can also include a second element directly bonded to the first element without a...