ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,661, issued on May 13, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).
"Reliable hybrid bonded apparatus" was invented by Cyprian Emeka Uzoh (San Jose, Calif.) and Pawel Mrozek (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Reliable hybrid bonded apparatuses are provided. An example process cleans nanoparticles from at least the smooth oxide top layer of a surface to be hybrid bonded after the surface has already been activated for the hybrid bonding. Conventionally, such an operation is discouraged. However, the example cleaning processes described herein increase the electrical reliability of mic...