US Patent Issued to Adeia Semiconductor Bonding Technologies on March 25 for "Embedded cooling systems with coolant channel for device packaging" (California Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,099, issued on March 25, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Embedded cooling systems with coolant channel for device packaging" was invented by Guilian Gao (Campbell, Calif.), Belgacem Haba (Saratoga, Calif.) and Laura Mirkarimi (Sunol, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some implementations, a device package may include a package substrate, a package cover disposed on the package substrate, and an integrated cooling assembly disposed between the package substrate and the package cover. The integrated cooling assembly may include a semiconductor device and a cold plate having a f...