US Patent Issued to Adeia Semiconductor Bonding Technologies on June 3 for "Fluid channel geometry optimizations to improve cooling efficiency" (California, North Carolina Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,677, issued on June 3, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Fluid channel geometry optimizations to improve cooling efficiency" was invented by Ron Zhang (Sunnyvale, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.), Belgacem Haba (Saratoga, Calif.), Kyong-Mo Bang (Fremont, Calif.), Laura Wills Mirkarimi (Sunol, Calif.) and Suhail Jaan Sadiq (Dublin, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the integrated cooling assembly includes a semiconduct...