US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on June 3 for "Diffusion barrier for interconnects" (California Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,650, issued on June 3, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Diffusion barrier for interconnects" was invented by Rajesh Katkar (Milpitas, Calif.) and Cyprian Emeka Uzoh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Representative implementations of techniques and devices are used to reduce or prevent conductive material diffusion into insulating or dielectric material of bonded substrates. Misaligned conductive structures can come into direct contact with a dielectric portion of the substrates due to overlap, especially while employing direct bonding techniques. A barrier interface that...