US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on June 3 for "Bonded structure with interconnect structure" (California Inventor)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,718, issued on June 3, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Bonded structure with interconnect structure" was invented by Belgacem Haba (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure is disclosed. The bonded structure can include an interconnect structure. The bonded structure can also include a first die directly bonded to the interconnect structure. The bonded structure can also include a second die mounted to the interconnect structure. The second die is spaced apart from the first die laterally along an upper surface of the interconnect structure. The second die is...