ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,025, issued on June 24, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).
"Microelectronic assemblies" was invented by Belgacem Haba (Saratoga, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of fanout packages are disclosed. A method of forming a microelectronic assembly is disclosed. The method can include bonding a first surface of at least one microelectronic substrate to a surface of a carrier using a direct bonding technique without an intervening adhesive, the microelectronic substrate having a plurality of conductive interconnections on at least one surface of the microelectronic subs...