US Patent Issued to Adeia Semiconductor Bonding Technologies on June 24 for "Electronic device cooling structures bonded to semiconductor elements" (California, North Carolina Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,083, issued on June 24, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Electronic device cooling structures bonded to semiconductor elements" was invented by Belgacem Haba (Saratoga, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.), Thomas Workman (San Jose, Calif.), Kyong-Mo Bang (Fremont, Calif.) and Ron Zhang (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling structure having a first side and a second side opposite the first side can be formed through a method comprising, forming an inlet and an outlet in a first substrate, forming at least one channel on the second side of the f...