US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on June 24 for "Dimension compensation control for directly bonded structures" (California, North Carolina Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,125, issued on June 24, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Dimension compensation control for directly bonded structures" was invented by Guilian Gao (San Jose, Calif.), Laura Wills Mirkarimi (Sunol, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.) and Cyprian Emeka Uzoh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of direct hybrid bonding first and second semiconductor elements of differential thickness is disclosed. The method can include patterning a plurality of first contact features on the first semiconductor element. The method can include second a plurality o...