US Patent Issued to Adeia Semiconductor Bonding Technologies on June 17 for "Cold plate cavity designs for improved thermal performance" (California, North Carolina Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,141, issued on June 17, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Cold plate cavity designs for improved thermal performance" was invented by Ron Zhang (Sunnyvale, Calif.), Belgacem Haba (Saratoga, Calif.) and Gaius Gillman Fountain Jr. (Youngsville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device package comprising an integrated cooling assembly. The integrated cooling assembly comprises a semiconductor device and a cold plate attached to the semiconductor device. The cold plate comprises a first side, a second side vertically adjacent to the first side, a first inlet, a first cavity, and a firs...