US Patent Issued to Adeia Semiconductor Bonding Technologies on July 29 for "Sealed bonded structures and methods for forming the same" (California Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,641, issued on July 29, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Sealed bonded structures and methods for forming the same" was invented by Rajesh Katkar (Milpitas, Calif.), Arkalgud R. Sitaram (Cupertino, Calif.) and Laura Wills Mirkarimi (Sunol, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure is disclosed. The bonded structure includes a first element that has a front side and a back side that is opposite the front side. The first element has a first conductive pad and a first nonconductive field region at the front side of the first element. The bonded structure also includes a se...