ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,556, issued on July 29, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).
"Processing stacked substrates" was invented by Cyprian Emeka Uzoh (San Jose, Calif.) and Guilian Gao (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Representative implementations provide techniques for processing integrated circuit (IC) dies and related devices, in preparation for stacking and bonding the devices. The disclosed techniques provide removal of processing residue from the device surfaces while protecting the underlying layers. One or more sacrificial layers may be applied to a surface of the device during processi...