US Patent Issued to Adeia Semiconductor Bonding Technologies on July 22 for "Embedded cooling systems for advanced device packaging and methods of manufacturing the same" (California, North Carolina Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,087, issued on July 22, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Embedded cooling systems for advanced device packaging and methods of manufacturing the same" was invented by Belgacem Haba (Saratoga, Calif.), Rajesh Katkar (Milpitas, Calif.), Ron Zhang (Sunnyvale, Calif.), Thomas Workman (San Jose, Calif.) and Gaius Gillman Fountain Jr. (Youngsville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device package comprising an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device. The cold plate comprises a top portion, sidewalls exten...