US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Jan. 28 for "Structure with conductive feature and method of forming same" (California Inventor)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,809, issued on Jan. 28, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Structure with conductive feature and method of forming same" was invented by Cyprian Emeka Uzoh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An element is disclosed. The element can include a non-conductive structure having a non-conductive bonding surface, a cavity at least partially extending through a portion of a thickness of the non-conductive structure from the non-conductive bonding surface, and a conductive pad disposed in the cavity. The cavity has a bottom side and a sidewall. The conductive pad has a bonding surf...